The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic mobile phone BGA rework station for iphone / samsung /HTC motherboard wi
Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci
We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr
Electronics Forum | Thu Jun 01 21:14:21 EDT 2006 | roadhound
Hello, We repair mobile (cellular) phones, and most are now having their u-BGA IC's underfilled. Can anyone suggest methods for removal of the IC's ? The manufacturers are very vague when it comes to this process, but are starting to get tired of u
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Industry News | 2023-07-22 07:29:05.0
Seamless Success: The Triumph of Semiconductor Production Line Delivery. Experience the pinnacle of efficiency and innovation as our expert team ensures the flawless delivery of a cutting-edge semiconductor production line. Elevate your manufacturing capabilities, boost productivity, and achieve unparalleled results in the semiconductor industry with our successful solutions.
Industry News | 2021-09-10 11:17:18.0
Next Generation of 16GB & 32GB Industrial-Grade Innodisk JESD79-5 DDR5 SDRAM Offer improvements in Capacity, Speed and Voltage
Parts & Supplies | Pick and Place/Feeders
JUKI KE710 card 710 CPU motherboard Other juki parts: 40003272 MAGNETIC SCALE Y(M) 40003273 MAGNETIC SCALE Y(L) 40003274 MAGNETIC SCALE X 40003277 LCD DSP(LC-N12P1SR-JK) →40025669 40003279 LCD DSP(LC-N1271SR-JK) *18 40003280 CPU BOARD →4004447
Parts & Supplies | Assembly Accessories
Long term spot supply: Samsung's original new SM/CP Feeder: 8 * 2mm 8 * 4mm 12mm 16mm 24mm 32mm 44mm 56mm Samsung original new SME Feeder: 8mm -56mm Samsung original new TN suction: TN040 TN065 TN140 TN220 TN400 TN400N TN750 TN1100 Samsung or
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Events Calendar | Wed Jan 20 00:00:00 EST 2021 - Fri Jan 22 00:00:00 EST 2021 | Tokyo, Japan
NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo
KingFei SMT Tech | https://www.smtspare-parts.com/sale-38180003-40003309-xy-amp-board-for-juki-ke2050-ke2060-machine-old-version.html
40003309 XY AMP Board For JUKI KE2050 KE2060 Machine Old Version Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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