SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
Featured Article Return to Front Page REFLOW SOLDERING
Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/
. Today’s blog will cover this topic and help shed some light on this vital topic. Learn more about the classifications below. Class 2 and Class 3 Standards These are quality standards established by IPC-A-610 that were created to better define the rules for building electronic assemblies
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
. But the good news is these are skills that anyone can refine and master with proper training and practice. In this webinar, you'll learn the best techniques of excellent communication
