Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau
after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc
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A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
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SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
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. This may be somewhat mythical and what little cracking is still observed usually tends to be due to defects in the manufacturing process of the capacitor
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Being as common as it is, manufacturers have come to recognize many of the underlying causes that cause solder ball defects. In this blog, we outline everything you need to know about solder balls, what you can do to avoid them, and potential steps for their removal
