Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Thu Jun 15 05:48:20 EDT 2006 | greg_diaz
Your concern should be do you have a glue process that can keep up with the FCP6. We ran a GL541 in line with a CP643 which the glue machine was actually a bottle neck because if you run SOIC's which require more glue dots then it will slowdown the
Electronics Forum | Thu Jun 15 08:27:06 EDT 2006 | jdengler
If you are asking does the CP-VI have a glue head on it, the answer is no. Jerry
Used SMT Equipment | Conveyors
More information: https://bajabid.com/product/universal-5362i-conveyor/ This machine is avalable for immediate purchase. Please contact us with any interest. (813) 992-2437.
Used SMT Equipment | Conveyors
More information: https://bajabid.com/product/universal-5384i-conveyor/ This machine is avalable for immediate purchase. Please contact us with any interest. (813) 992-2437.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-07-02 07:23:51.0
Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases
Parts & Supplies | SMT Equipment
Yamaha IO card of YAMAHA machine Specs: IO card of YAMAHA machine All control board for YAMAHA machine provide with repair service. YG200 INTERFACE BORD KGR-M4530-01X YG200 KEYBOARD KGA-M6590-000 YG200 SYSTEM UNIT KGK-M4200-101 KGK-M4200-00X YG200 VI
Parts & Supplies | SMT Equipment
Yamaha Driver board for YAMAHA machin Specs: Driver board for YAMAHA machine All control board for YAMAHA machine provide with repair service. YG200 INTERFACE BORD KGR-M4530-01X YG200 KEYBOARD KGA-M6590-000 YG200 SYSTEM UNIT
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Feb 07 00:00:00 EST 2024 - Wed Feb 07 00:00:00 EST 2024 | ,
Wine Down Wednesday: Enabling a Global Resilient Supply Chain with Technology Leadership
Events Calendar | Fri Sep 08 00:00:00 EDT 2023 - Fri Sep 08 00:00:00 EDT 2023 | Chihuahua, Mexico
I.C.T Boosts Technological Advancements: Sponsors SMTA Exhibition in Mexico
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | Bronx, New York USA | Production,Technical Support
90% of my working experiences, are related with SMT environment: I been dealing with a lot different situation for the last 16 + years. I'm a handyman person as well. know to handle power and precision, etc. For the last year and a half I been in cha
Career Center | Williamsburg, Kentucky USA | Engineering,Production,Quality Control
SKILLS My computer skills are fluent with experience in Microsoft Word, Internet, WordPerfect and Microsoft Works. I have an extensive electronics background. I can type 40 wpm. I am multi-skilled with a vast knowledge in electronics and over 10 y
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/1002.html
Can I waterproof a PCB with conformal coating machine-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/a-00514-i-pulse-sdc-board-207620?page=446&order=list_price+asc
IPULSE I-Pulse SDC board A 00514 | QYSMT × Home about Us FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products I-Pulse SDC board Public Pricelist Public Pricelist I-Pulse SDC board
