Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
top reflow oven Place Semiconductor advanced packaging Pro Virtually no maintenance Pv Leadscrew Coating Solder ball David heller Coat curing oven Drying oven Conformal coat dying ovens Conformal coat Kic software manual 1827 mk7 5786 6572 Nfpa 86
| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx
Safety Product Mfr. 3rd in a Series – Over (40) Welders Just Arrived! Branson & Dukane Ultrasonic Welders! 2,500-Watt to 4,000-Watt Welders Available All New in 2020 and Prepped for Shipping Tempe, AZ Assets Formerly of Spartronics [Online] SOLD
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
Equipment Dealer / Broker / Auctions
104 East Street
Middleton, MA USA
Phone: 978 790-2774
