Industry Directory | Research Institute / Laboratory / School
The Sapienza University of Rome, formally the Università degli Studi di Roma "La Sapienza", abbreviated simply as Sapienza, is a public research university located in Rome, Italy.
Industry Directory | Research Institute / Laboratory / School
Peking University is a public research university in Beijing, China that is funded by the Ministry of Education of China. The university was established as the Imperial University of Peking in 1898 when it received its royal chart
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time
Electronics Forum | Tue Jan 22 18:19:30 EST 2019 | nniculita
Google: nick's software abbreviations you'll find the online database
Electronics Forum | Wed Jan 11 10:39:28 EST 2017 | davef
From “Nick's Software Blog” [http://nicks-software.com/wordpress/tag/list-of-abbreviations/ ] a very cool list of abbreviations … * SCU, Servo control unit or Sub-controller unit (on Fuji machines). * PMC, Placing module controller (on Q.P. Fuji ma
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2021-12-03 01:22:50.0
CNC machines is the abbreviation of "Computer Numerical Control" machines. It is an automatic machine tool with program control system. The control system can logically process the programs with control codes or other symbolic instructions, decode them and express them with coded numbers. Next, the coded numbers will be input into the numerical control device through the information carrier. After calculation and processing, the numerical control device sends out various control signals to control the action of the machine tool. CNC machine can automatically produce parts or other products according to the shape and size specified by the drawings.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
forces the electronics industry to look for safer alternatives, like lead-free solder. Lead-free solder can include various chemical elements such as tin, copper, zinc, manganese, silver, or gold, but the most commonly used is tin, silver, and copper, often abbreviated as SAC, derived
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
.............................................................................................9 3 Terms, definitions and abbreviated terms..........................................................10 3.1 Terms from other standards .....................................................................................10
