Complete supplier of EMI-shielding, conductive, resistive, & MW-absorptive materials - metallized fabrics, polypyrrole-coated fabrics, carbon nonwovens, magram, C-loaded foams, conductive fibers & filler, EMI gaskets, & resistive wire
We are in the stencil rolls distribution business based in Singapore. We offer a comprehensive range of stencil rolls/wipes (eg. DEK, EKRA, MPM, etc) that are made of high absorptive material with superior capillary action and cleaning properties.
Description： * The steel mesh wiper uses US imported material and is made under advanced equipment. * For removing the paste on the circuit plate and keeping it clean for electronic factory. * With high water absorption, oil absorption and anti
Equipment used in the physical and electrical measurements of semiconductors and their components. Includes atomic absorption tools, thickness measurement tools, x-ray fluorescence (XRF) tools, mapping tools, microscopes, photovoltage measurement to
Electronics Forum | Wed Dec 13 13:42:57 EST 2000 | Mike Ihm
The dielectic absorption characteristic of printed circuit board materials is usually not listed on the manufacturers spec. sheets. Can anyone point me in a direction to help determine which laminate materials might exhibit better dielectric absorpt
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Used SMT Equipment | Pick and Place/Feeders
Product number: JUKI - JX350 Product details: JUKI JX - 350 long base board high-speed chipmounter Features: Chip components 32000 CPH (best conditions) Element size Laser recognition: 0603 ~ 33.5 mm squareelement length Laser mount head * 1
Used SMT Equipment | SMT Equipment
Product name: JUKI - JX350 Product number: JUKI - JX350 Product details, JUKI JX - 350 long base board high-speed chip mounter Features: Chip components 32000 CPH (best conditions) Element size Laser recognition: 0603 ~ 33.5 mm square ele
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
Parts & Supplies | Pick and Place/Feeders
ESS Barcodereader absorption_SP11/BM10
Parts & Supplies | Pick and Place/Feeders
Electric Feeder VISKER-12MM Electric Feeder VISKER-12MM Features: Versatility The current development of the electric Feeder has a strong versatility, for the current JUKI KE-700 series, KE-2000 series, FZ JX-300 series models can be simply upgr
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
JUKI feeder calibration---ZK Electronic Technology Co., Limited
PCB vacuum suction loader/SMT vacuum loader for loading bare board on PCB assembly line: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/123.html ASCEN PCB vacuum loader we produced is mainly used for the beginning of the SMT produc
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. While absorption contrast X-ray imaging is a very powerful inspection technique, it does not exploit all of the information present within the X
ORION Industries | http://orionindustries.com/pdfs/insulating.pdf
. Design considerations typically include: • Electrical properties • Moisture absorption and dimensional stability • Ease of fabrication and manufacturing tolerances
