Industry Directory | Manufacturer
Manufacturer of commercial and custom switching systems used in the electronics test market and for imbedded switch systems in OEM equipment.
Industry Directory | Manufacturer
Multiaxis Distributed Motion Control uniquely integrating power and control into one compact module.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Test Equipment
Inline test system for incircuit and functional tests with Teradyne measuring equipment ENGMATEC presented for the first time a test handler with integrated Test Station Inline TSi from Teradyne. On request of the Boston company Teradyne, a test
Electronics Forum | Tue Oct 20 09:46:16 EDT 1998 | Tom Gervascio
I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. I am looking fo
Electronics Forum | Fri Oct 23 15:15:51 EDT 1998 | Dave f
| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2003-06-09 09:41:14.0
Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Parts & Supplies | Other Equipment
SIEMENS 6ES73401AH008BA CP340 COMM MOD SIEMENS 6ES73401AH008CA CP340 COMM MOD SIEMENS 6ES73401AH008EA CP340 COMM MOD SIEMENS 6ES73401AH010AE CP341 COMM MOD SIEMENS 6ES73401AH017EA CP341 COMM MOD SIEMENS 6ES73401BH000AE CP341 COMM MOD SIEMENS 6E
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-01-30 21:20:47.0
Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
03027548-01 Guide, left-hand side 03027563-01 Loctite 7063 CLEANER 03027570-03 HOTLINK CARD CPCI A14 K-01 03027644-01 HOLDER FOR CABLE INTERFACE 03027646-02 JUMPER 120 Ohm SUD-D PIN 03027905-01 Adapter cable MTC2 CAN bus 03028249-02 Pneumatic S
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years design of RF microwave and support circuitry for miniturized RF/Wireless modules. Prefer someone out of Telecom. Duties/Funtions: CDMA, GSM would like to have Engineer out of small hand held mobile radio MFG. Prefer mi
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | rawalpindi, Pakistan | Production
Handling the production line including two SWISS pick and place machines cobra and paraquda ,tucano printer reflow oven ,samsung loader and unloader.Hand on experience with 3D camera inspection system and solder paste height measuring instrument and
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Infrared-Preheat-Module-User-Guide-22140087.pdf
. 101.6 mm (4”) diameter Flow rate per port . . . . . 7,079 l/min (250 CFM) ‡Customer supplies ducting to exhaust port Communications User interface . . . . . . . . Touch Screen with Infrared Preheat Module User Guide control software µSD card
| https://www.feedersupplier.com/sale-13119536-smt-spare-part-03011739-siemens-siplace-energy-data-interface-cpl-siemens-siplace-asm-x-series-feede.html
smt spare part 03011739 Siemens/siplace Energy Data Interface Cpl Siemens/siplace ASM X series feeder simens spare part Leave a Message We will call you back soon