New SMT Equipment: acf bonder (7)

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

New Equipment | Soldering Robots

Microprocessor-based controller provides precise and consistent temperature control.   Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.   Flexible programmable profiles for targeted idle, preheat and re

ChuangWei Electronic Equipment Manufactory Ltd.

Rotary Air Cooling Hotbar Welding Machine 0.4 To 0.6 MPa 2 Set Vaccum

Rotary Air Cooling Hotbar Welding Machine 0.4 To 0.6 MPa 2 Set Vaccum

New Equipment | Depaneling

Hot Bar Soldering Machine Thermode Soldering Machine Hotbar Welding Machine Technical parameters: 1 Power supply: AC220V ± 10%, 50Hz, 3500W 2 Work environment :10-60 ℃, 40% ~ 95% 3 Working pressure: 0.5 ~ 0.7Mpa 4 Welding pressure: 2.5 ~

ChuangWei Electronic Equipment Manufactory Ltd.

Industry News: acf bonder (2)

Finetech Unveils High Force ACF Bonder

Industry News | 2013-11-08 18:07:48.0

Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Finetech

TG-1000 Hotbar Bonding System for Small Displays and Wearable Products

Industry News | 2017-05-26 14:54:11.0

Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning

Toddco3

Express Newsletter: acf bonder (32)

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process


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