Industry Directory | Manufacturer's Representative
Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p
Copper Oxide for Parallel Electronic Plating System (PCB industry). Pan-Continental (H. K.) Limited is the biggest Copper and Zinc compound in Taiwan. Welcome to cooperate with your company.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel
BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Used SMT Equipment | General Purpose Equipment
Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solder Paste Dispensing attachment Upgraded to new Aluminum work
Used SMT Equipment | General Purpose Equipment
Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solder Paste Dispensing attachment Upgraded to new Aluminum work
Industry News | 2003-02-20 08:39:01.0
Purchased the inventory and rights to the replacement parts business of Advanced Chemill Systems
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
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Parts & Supplies | SMT Equipment
YAMAHA KHY-M7154-00 KHY-M7154-01 BIT 34W Vacuum valve copper core Yamaha Spare parts specification: YAMAHA KGT-M917U-01X SENSOR POS OMRON E3S-LS3P YG200 YAMAHA 90K21-038011 YG12_YS12 R axis driver motor YAMAHA 90K55-4W074Z&90K50-4W074Z AC SE
Parts & Supplies | Chipshooters / Chip Mounters
YG100 Vacuum plate KHL-M4592-00 Yamaha Spare parts YAMAHA KGT-M917U-01X SENSOR POS OMRON E3S-LS3P YG200 YAMAHA 90K21-038011 YG12_YS12 R axis driver motor YAMAHA 90K55-4W074Z&90K50-4W074Z AC SERVO MOTOR YV100XG YAMAHA 90933-03
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-11-12 19:04:51.0
In order to provide the functionality in today’s electronics, printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces, this means no nodules, no pits, and excellent ductility with thinner deposits. One of the areas that has to change to get to this plateau of technology is acid copper plating. Acid copper systems have changed in minor increments since their introduction decades ago. However, the basic cell design using soluble anodes in slabs or baskets has for the most part remained the same. Soluble, phosphorized, copper anodes introduce particulate and limits the ability to control plating distribution.
Nano-copper sintering in formic acid vapor.
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
SMTnet Express, November 12, 2015, Subscribers: 23,731, Members: Companies: 14,745, Users: 39,326 The Perfect Copper Surface Eric Stafstrom; Technic Inc. , Garo Chehirian; Tech-Etch In order to provide the functionality in today's electronics
| https://www.eptac.com/faqs/ask-helena-leo/ask/copper-elongation-and-tensile-strength-requirements
? For example, military standard MIL-PRF-31032 states copper elongation shall... Question: IPC-TM-650, 2.4.18.1 is the method for testing in-house plating for tensile strength and elongation, but where can I find the IPC requirements for results
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Electroplating, Stripping, and Etching With the conductive pattern and drilled holes exposed, the panel is placed into a copper plating bath containing sulfuric acid and copper sulfate
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