Industry Directory | Manufacturer
The main activity of ACP is the design, development and manufacture of potentiometers and resistive/conductive elements (including screen printing on different substrates).
Industry Directory | Consultant / Service Provider
SMT Tape and Reel service
ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Used SMT Equipment | In-Circuit Testers
R&S FSU8 Spectrum Analyzer 20 Hz to 8 GHz To handle the wide variety of measurement tasks in product development, an instrument must offer ample functionality and excellent performance in all areas of interest. The R&S FSU fully meets these require
Used SMT Equipment | In-Circuit Testers
R&S FSU8 Spectrum Analyzer 20 Hz to 8 GHz To handle the wide variety of measurement tasks in product development, an instrument must offer ample functionality and excellent performance in all areas of interest. The R&S FSU fully meets these require
Industry News | 2022-03-14 08:18:45.0
Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's' representative, Berlin will be responsible for business development with Mina™, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina™ offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
E9641729000 MAGNESCALE DETECTOR (30) E964172900A DETECTOR AMP (30) E964172900B SENSOR HEAD CABLE ASM (8M) E9641729A00 DETECTOR AMPLIFIER(30) E9641729B00 SENSOR HEAD(X AXIS 8M) E9641729C00 SENSOR HEAD(Y AXIS 8M) E9641855000 PANEL COMPUTER
E9641729000 MAGNESCALE DETECTOR (30) E964172900A DETECTOR AMP (30) E964172900B SENSOR HEAD CABLE ASM (8M) E9641729A00 DETECTOR AMPLIFIER(30) E9641729B00 SENSOR HEAD(X AXIS 8M) E9641729C00 SENSOR HEAD(Y AXIS 8M) E9641855000 PANEL COMPUTER
Heller Industries Inc. | https://hellerindustries.com/parts/460207/
460207 - FLUX JAR, TWIN, BANK OF 4 ACP-MIDDLE, BOTTOM Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11658453-fx3-128j-cpu-acp-128a-avalon-data-juki-fx-3-cpu-board-40044475.html
FX3 128J CPU ACP-128A Avalon Data JUKI FX-3 CPU Board 40044475 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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