Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Distributor / Manufacturer
AllPoint Electronics is specialized in SMT, PTH, and TEST Equipment and services for electronics industry in Brazilian market. We provide full support for PCB assembly factory implementation, and process consulting
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
Electronics Forum | Wed Dec 03 07:26:35 EST 2008 | realchunks
Careful on fine pitch QFPs. They will be your weakest joint if your parts are no-lead. And don't think you can simply run a no-lead profile either. Depending on your paste, you cannot simply run your profile in the no-lead temps and expect your fl
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Heller Industries Inc. | https://hellerindustries.com/award
– constantly bringing new innovations to market faster and with greater impact than our competitors. Past Awards Company of the Year Award (Soldering Equipment) Category
| http://etasmt.com/cc?ID=te_news_bulletin,24966&url=_print
. Within the past few years, the trend to favor companies with “green” manufacturing policies has gained increasing importance. Green manufacturing operations follow environmentally friendly practices that minimize adverse impacts such as emissions or landfill contamination
