Industry Directory: adhesive joint strength (12)

United Adhesives, Inc.

Industry Directory | Manufacturer

United Adhesives makes special adhesives, coatings, potting gels, sealants, various conductive adhesives, and optical adhesives for applications in electronics, semiconductors, and telecommunications.

YINCAE Advanced Materials, LLC.

Industry Directory | Manufacturer

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

New SMT Equipment: adhesive joint strength (88)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Electronics Forum: adhesive joint strength (330)

joint strength

Electronics Forum | Wed Nov 26 09:16:59 EST 2008 | barryg

Hello everyone, after a short layoff I am glad to be back. I have a question. I have a button (snap button) that is being soldered to a strip of sac coated copper. We are questioning the joint strength of this from our vendor as we see these popping

joint strength

Electronics Forum | Wed Nov 26 11:19:58 EST 2008 | vladig

I don't think you can find any specs on that. As long as a solder joint can not be broken by virtually "blowing over it" any reading on the UTS, or shear strength can be very confusing. You can specify, though that the assembly (joint) should withsta

Industry News: adhesive joint strength (376)

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Rogers Corporation Reports 50% Increase in Earnings

Industry News | 2003-04-25 08:11:22.0

Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.

SMTnet

Parts & Supplies: adhesive joint strength (182)

Yamaha KLF-M7155-000 filter joint AXT1197-1-2A

Yamaha KLF-M7155-000 filter joint AXT1197-1-2A

Parts & Supplies | Pick and Place/Feeders

KLF-M7155-000 filter joint AXT1197-1-2A Part name: filter joint Part number: KLF-M7155-000 Model number: AXT1197-1-2A Machine model: Yamaha Other Yamaha parts we have in stock: Brushless DC San Ace 25 109P1212H4D16 Fan Yamaha Fan San Ace

ZK Electronic Technology Co., Limited

Panasonic Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic

Panasonic Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic

Parts & Supplies | Assembly Accessories

Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is

KingFei SMT Tech

Technical Library: adhesive joint strength (27)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

The Future of Solder Joint Encapsulant

Technical Library | 2016-01-08 11:56:03.0

Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives.

YINCAE Advanced Materials, LLC.

Videos: adhesive joint strength (26)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Events Calendar: adhesive joint strength (6)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: adhesive joint strength (1)

Pacific Northwest Business Development Manager - SMT

Career Center | , Washington USA | Engineering,Management,Sales/Marketing

Do yor sales abilities over sell your current EMS employer? Are you tired of bringing in millions of dollars of potential new business, only to find out your company cannot close the deals or doesn't have the capacity to handle your clients? If you

DCSI Consultants

Career Center - Resumes: adhesive joint strength (7)

Sales&Marketing, Business Development

Career Center | Sungai Ara, Penang Malaysia | Management,Sales/Marketing

Spoken skills : English, Malay, Chinese, Cantonese, Korean (Basic) Writing skills : English, Malay, Chinese, Korean (Basic) Computer skills : Microsoft Office (Word, Excel, PowerPoint) Personal : Sense of responsibility, quick learner, can work in

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Express Newsletter: adhesive joint strength (468)

The Future of Solder Joint Encapsulant

Materials, LLC. Solder joint encapsulant adhesives have

SMTnet Express - January 14, 2016

SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Solder joint encapsulant adhesives have been

Partner Websites: adhesive joint strength (2926)

SMT 8mm Single Splice Tape Yellow Color SMD Joint Tape Strong Adhesive

KingFei SMT Tech | https://www.smtspare-parts.com/sale-10178100-smt-8mm-single-splice-tape-yellow-color-smd-joint-tape-strong-adhesive.html

SMT 8mm Single Splice Tape Yellow Color SMD Joint Tape Strong Adhesive Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

Adhesive Transfer Tapes with Adhesive 300LSE, 9453LE, 9471LE, 9471LE

ORION Industries | http://orionindustries.com/pdfs/300lse.pdf

: Technical Data September, 2002 Tape 9453LE Tape 9471LE Tape 9472LE Adhesive: 3.6 mils (91 microns) 2.3 mils (58 microns) 5.2 mils (132 microns) (Solvent Free) 3M High-strength 3M High-strength 3M High-strength Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive 300LSE 300LSE 300LSE Liner

ORION Industries


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World's Best Reflow Oven Customizable for Unique Applications
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