Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Burnt shrink sleeve information added to section. 11 610 Changes New sections 7.1.8.1 and 7.1.8.2 Connector Mounting Modified 7.2.2.1. Adhesive bonding Modified 7.3.5.1 new criteria for vertical fill of plated through holes for Class 2 products
