Industry Directory | Manufacturer
Wisman High Voltage Power Supply Co.,Ltd, is the professional X-ray generator, DC high voltage power supply, PCB mount module and X-ray source manufacturers.
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Electronics Forum | Mon Apr 25 21:52:58 EDT 2005 | KEN
I wonder if yor customer means wrong "flux"? Your not solderng to gold. Your soldering to Nickle. The gold is disolved and dispersed. Your joint strength comes from the SnNi intermetalic.
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Used SMT Equipment | SMT Equipment
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2020-11-24 00:34:15.0
The ultrasonic spray dryers are targeted for laboratory applications.Equipped with a non-clogging ultrasonic atomizing nozzle, designed to handle water-based and solvent-based liquids. The machine is equipped with formula storage and data recording functions, as well as an ultrasonic dispersion syringe and heating plate.
Industry News | 2017-07-19 21:09:38.0
STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
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Parts & Supplies | Assembly Accessories
Electronic Products Machinery SMT Spare Parts Original New FUJI Plate Dispersion ADNGC8333 For FUJI Pick and Place Machine Electronic Products Machinery FUJI Plate Dispersion ADNGC8333 Plate Dispersion ADNGC8333 For FUJI NXT Machine SMT FUJI NXT P
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Parts & Supplies | Chipshooters / Chip Mounters
FUJI PLATE DISPERSION AGGGC8043 WPA1420 SPRING WPA1201 HOOK,SPRING WPA1721 SPRING WPA1543 BKT WPA1552 BKT S2085H CYLINDER,AIR WPA1560 BKT WPA1570 WASHER WPA1710 PIN H31811 PLATE,END WPQ0082 BOLT,STUD WPQ0451 BOLT,STUD GPH4491 ROLLER H4
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/solutions/lighting-and-led
throughput with our automated assembly applications such as: Potting / encapsulation Thermal dispersion / Heat Management Gasketing Bonding Sealing
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
. Power Source Operate the PBFT only from the type of power source indicated on the data plate. Grounding The PBFT is equipped with a 3-wire grounding type plug
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