Industry Directory | Manufacturer
Shenzhen Gold Sky PCB Technology Co., Ltd. is a one-stop value-added service provider which takes manufacturer as the means and quality services as the final goal.
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Assembly Services
Premium Automatic PCB Support for SMT Processes Ovation’s award-winning Grid-Lok Gold™ automatic substrate support technology provides electronics manufacturers with a robust alternative to costly and often problematic dedicated fixture plates. Set
Electronics Forum | Thu May 30 14:35:00 EDT 2002 | davef
Hey Jim, What can you tell us about the causes, results, and prevention of 'fretting corrosion' in connectors? Jim, I'm not adding this to insult you, but as a source of more information for those that are not familiar with the topic. Background o
Electronics Forum | Mon May 06 12:20:09 EDT 2013 | davef
Gold in solder alloys can be brittle. We always used to talk about keeping gold LT 3% in order to avoid embrittlement. Some military contracts require removal of gold from soldered contacts. Adding gold to a solder alloy that you're familiar with wi
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2013-11-21 17:52:49.0
Despite chilly temperatures in Munich last week, things got “heated” as 43 competitors went soldering iron to soldering iron at IPC’s Hand Soldering Competition at productronica 2013, November 12–15. Emerging victorious and taking first place, a cash prize of €500 and a new soldering station from JBC Tools, was Jacek Majchrzak, PartnerTech, Poland.
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Parts & Supplies | Pick and Place/Feeders
CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik
Parts & Supplies | Pick and Place/Feeders
We are specialized in the field of repair service for CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/ 750/760/2010/2020/2030/2040/2050/2060/2070/ 2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/ JX-100 laser unit),YAMAHA laser,SAMSUNG lase
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
we have many universal gold plus feeders to sell . www.smt-store.com
we have many universal gold plus feeders to sell . www.smt-store.com
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
