Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Mon Oct 22 21:34:36 EDT 2007 | davef
Double check on this, but we have this little voice in our heads telling us that your AgPd termination is intended for conductive adhesive applications. Check with your component supplier. We recall a thread on SMTnet [ http://www.smtnet.com/forums
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
. My question is, would you use that ROL0 solder on the entire solder termination when... Question: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
is interesting to note that Ag was detected in the fracture area. Figure 11. Fracture Area of SnPb Joint Reflowed at 215C for 90 sec. Figure 12. Fracture Area of SAC305 Joint Reflowed at 250C for 90 sec. A typical termination structure of lead-free
