Industry Directory | Other / Manufacturer
Established in 2002, We specialize in the production of composite materials, engineering plastic, PCB solder pallet material, wave&reflow solder pallet. composite stone (Durostone), Bakelite sheet, glass fiber POM sheet & Acrylic.
Industry Directory | Manufacturer / Manufacturer's Representative
iTECH II provides a broad range of SMT and PTH assembly solutions to meet a wide range of Customer applications.
Ersa SMT Reflow Oven HOTFLOW 4/26 Max. PCB width: 560 mmHeating Zones: 26 zonesThrough Put: 352PCB/hourWeight: 2800KGDimension: 7100x1410x1500mmPower: 400 V / 3 / N / PE - 50 Hz / 60 Hz Ersa SMT Reflow Oven HOTFLOW 4/26 Ersa SMT Reflow Oven H
Ersa HOTFLOW 3/14e Reflow Oven Working width: 45-516 mmProcess length: 3,345 mmHeated length: 2,610 mmCooling length: 735 mmWeight appr. 1,450 kgDimension: 4,770x1,201x1,375 mm Ersa HOTFLOW 3/14e Reflow Oven Ersa HOTFLOW 3/14e Reflow Oven Dua
Used SMT Equipment | Repair/Rework
● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Computers and mobile phones are the most common electronic products in our daily life. They all adopt modern electronic technology and communication technology, providing great convenience and entertainment for people. Computers are composed of cent
Features▶Use self-developed control software▶ More precise control of temperature and speed▶Temperature and speed curve display▶No counterweight, faster to use▶Super silent▶Use original accessories The solder paste mixer can effectively mix the tin p
Training Courses | | | IPC J-STD-001 Expert (CSE)
The IPC J-STD-001 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC J-STD-001 standard.
Training Courses | ON DEMAND | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Hawthorne, California USA | Engineering
SMT PROCESS ENGINEER (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Zhang Abstract 28-1 PoP Rework - A Case Study Robert Wettermann Abstract 2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Abstract 27
