Industry Directory | Manufacturer / Manufacturer's Representative
iTECH II provides a broad range of SMT and PTH assembly solutions to meet a wide range of Customer applications.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer
Alpha 1 Technologies is the leading provider to the electronic printed circuit board assembly market. We strive to provide value driven solutions, whether new equipment or used, remanufactured assembly machines since 1999.
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
New Equipment | Assembly Services
Ideal for hand-held to large storage devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and opt
Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Wed Apr 18 06:18:53 EDT 2007 | pavel_murtishev
Good afternoon, Huh. My sympathy. We have the same issue. Check this: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11637&mc=3 BR, Pavel
Used SMT Equipment | Repair/Rework
● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Parts & Supplies | Pick and Place/Feeders
JUKI EA9500B0000 CLIP CV-70S www.fujintai.com JUKI EA9500B0100 CABLE BAND FUJINTAI TECHNOLOGY CO.,LTD JUKI EA9500B0200 CABLE BAND 150 www.fujintai.com JUKI EA9635B0000 SOCKET FUJINTAI TECHNOLOGY CO.,LTD JUKI ES000175000 8 STAINLESS TUBE N2 www.fu
Parts & Supplies | Assembly Accessories
JUKI NGA JIP PLATE A ASM E21499980A0 We are Supply SMT Pick and Place Equipment spare parts(Smt nozzle, Smt Cylinder, Smt Valve, Smt Sensor, Smt Feeder, Smt CPU Board, Smt Laser, Smt driver, Smt ejector……) for Yamaha, JUKI, FUJI ,Panasonic, Samsun
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Hawthorne, California USA | Engineering
SMT PROCESS ENGINEER (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | Poplar Grove, Illinois USA | Management,Production,Quality Control,Technical Support
20+ years in electronic manufacturing, sales support,customer support.
Career Center | Melbourne, Florida USA | Engineering
I have over 24 years experience in the PCB manufacturing arena. My career knowledge is in most SMT manufacturing equipment. Creating and troubleshooting manufacturing assembly processes and creating detailed work instructions using Microsoft Power
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Zhang Abstract 28-1 PoP Rework - A Case Study Robert Wettermann Abstract 2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Abstract 27
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