New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
New Equipment | Assembly Services
Shenzhen YatSing PCB Co,.Ltd has been supplying printed circuit boards since 1981 ,as a leading manufacturer of Printed Circuit Boards in China,we provide excellent quality and lower price(specially lower price in single&double layer boards),and we
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2003-03-03 08:48:54.0
The International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium.
Parts & Supplies | Circuit Board Assembly Products
N510025620AA Pressure Senor W/CONNECTOR MPS V6T-AG-0.26M-KM-RH Machine DT401 01FDC081121 Pressure Sensor KXF0DQXA00 Connector MPS V6T-AG-0.26M-KM-RH KXFY1544A00 Pressure Senor W/CONNECTOR Panasonic KME CM212-M(NM-EJM6A) Modular Placement Ma
Parts & Supplies | Pick and Place/Feeders
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Technical Library | 2021-07-06 21:18:02.0
A new PCB surface finish has been developed that offers outstanding performance and excellent environmental protection. This finish has the potential to replace more common finishes such as ENIG, ImAg, ImSn, ENEPIG, or OSP with a chemically resistant plasma deposited coating. The substitution of the wet processes with this dry plasma process offers significant advantages e.g. lower quantities of chemicals used, environmental benefits and improved operator safety.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/adhesive-dispensing-systems/products/pumps-and-pump-systems?con=t&page=12
für Nordson Kolbenpumpen-Klebstoffschmelzgeräte und pneumatische Applikatoren. AG-900+S Modularer Auftragskopf Adhesive Dispensing Systems Der modulare Aufbau des Auftragskopfes AG-900
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
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