Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
New Equipment | Fabrication Services
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi
The AccuThermo AW410 was derived from the AG Associates 610 production-proven design. Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system. The system uses high in
Electronics Forum | Sun Sep 15 21:44:41 EDT 2002 | jason
Hi Dave, Immersion Ag has poor surface appearances after reflow or rather tarnished, while Immersion Tin requries higher temp. Probably that's why Immersion Ag is more preferred.
Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay
Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr
Used SMT Equipment | Soldering Equipment/Fluxes
The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre
Industry News | 2003-03-03 08:48:54.0
The International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium.
Industry News | 2003-04-10 10:06:38.0
International Conference on Lead-Free Electronics on June 10-13, 2003, in Brussels, Belgium
Parts & Supplies | THT Equipment
Panasonic Glass N414RA101 Panasonic smt spare parts smt machine N510039711AA BOLT N510026714AA HANDLE N510017539AA BOLT KXFP6J9XA00 CABLE-SUPPORT N510017536AA BOLT N210130669AA PLATE N210130670AA PLATE N210123491AB BRACKET N210122562AB BR
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Parts & Supplies | Pick and Place/Feeders
N210109230AD BLOCK N210093674AB PLATE N210068033AG COVER N210084787AB PLATE N210089397AC COVER N610072314AF PLATE N510044829AA LINEAR-WAY N510027883AD LINEAR-SCALE N510039150AA MOTOR N510039151AA MOTOR N510030563AA SPACER N986MMS410 PIN N
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Technical Library | 2014-11-06 16:43:24.0
This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
This conveyor allows for contact with the engineer, for transportation to a work table for inspection. • SMEMA Interface • Durable structure with double base plate • Buzzer • Body: 810mm; Gateway: 600mm • Sliding with st
SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb
| https://pcbasupplies.com/koki-solder-wire-s03x7ca-72m-0-4-mm/
– 0.4 mm Anti Iron Tip Erosion Super Low Ag Flux Cored Wire Solder 72M series contain new and more active activator for improved wettability and new resin composition for better flux coverage
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