Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef
8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5
Electronics Forum | Mon Apr 30 06:44:34 EDT 2007 | dszeto
Is there any benchmarking / report available on the industry regarding to the application of leadfree solder Sn(99%)/Ag(0.3%)/Cu(0.7%) e.g. Alpha Metals SACX0307 compared to SAC305? Thanks! Daniel
Used SMT Equipment | Soldering Equipment/Fluxes
The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre
Industry News | 2012-10-05 16:48:23.0
IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Parts & Supplies | SMT Equipment
JUKI 2060 EJECTOR 40001266 C-0023-MCX MPS-V8 V8X-AG-0.3B-JU
Parts & Supplies | General Purpose Equipment
JUKI 2050/2060 EJECTOR CONVUM C-0022-MCX MPS-V8 V8X-AG-0.3B-JU
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
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