New Equipment | Solder Materials
AMTECH’s Premium Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All AMTECH bar solder is manufactured from a variety of high purity virgin metals that exceed th
Fisher Control Valves & Regulators Fisher Products process control valves, digital valve controllers, pressure regulators and field automation systems Fisher,Emerson Process Management,Valves,Control Valves,Actuators,Process Instruments,Instrumentati
Electronics Forum | Wed Aug 24 03:12:01 EDT 2011 | richieoreilly
Hi, The solder we use is Sn5Pb93.5Ag1.5. with a melting point of about 30 degrees.
Electronics Forum | Mon Jul 22 14:01:31 EDT 2013 | jax
HMP can mean a lot of things, although it is normally used as the generic name for one of the following alloys: Pb93.5 Ag1.5 Sn5 (296°C-301°C) Pb95 Sn5 (308°C-312°C) Pb97.5 Ag1.5 Sn1 (309°C) If you are talking abou
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Parts & Supplies | Pick and Place/Feeders
SM482 machine part carbon chip Maintenance plate for dry-pump KHB200A-304A-G1 Samsung J72531005C FC09-004094B HP09-900109 HP14-000718 J91741021A FC30-001289A EP20-900101 FC09-004095B J70531054A J70531052C J70531051C J70531053C EP19-900108 FC18-90
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Parts & Supplies | Pick and Place/Feeders
SM482 machine part Paper Spacer for for dry-pump KHB200A-304A-G1 J72531005C FC09-004094B HP09-900109 HP14-000718 J91741021A FC30-001289A EP20-900101 FC09-004095B J70531054A J70531052C J70531051C J70531053C EP19-900108 FC18-901994 FC38-900013 FC29
Technical Library | 2020-09-23 21:29:25.0
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305) solder. The many possible advantages and some disadvantages / challenges are discussed. Until recently, the use of Sn/Bi based materials has been investigated with negative consequences for high strain rate (drop-shock) applications and thus, these alloys have been avoided. Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. We tested the manufacturability and reliability of three low-temperature and one SAC-305 (used as a control) solder paste materials. Two of these materials are doped Sn/Bi/Ag and one is just Sn/Bi/Ag1%. We will discuss the tests and related results. And lastly, we will discuss the prospects, applications and possible implications (based on this evaluation) of these materials together with future actions.
This conveyor allows for contact with the engineer, for transportation to a work table for inspection. • SMEMA Interface • Durable structure with double base plate • Buzzer • Body: 810mm; Gateway: 600mm • Sliding with st
Usually the last machine the PCB passes through to allow flow of the line and contact with the engineer to inspect on work table. • SMEMA Interface • Durable structure with double base plate • Buzzer • Body: 810mm; Gateway: 600
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