Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
The Agilent Medalist 5DX Series 5000 offers 3-D Automatic X-Ray inspection capability, enabling inspection of both sides of a double-sided panel in one pass. Customer CAD is converted to an inspection program, enabling 100% solder joint inspection t
Electronics Forum | Mon Jan 14 07:29:48 EST 2008 | benzy1961
We have an Agilent SP50 system. It is a 3-D system. The programming is pretty simple relative to some of the other machines we evaluated.
Electronics Forum | Fri Jan 25 18:22:03 EST 2008 | mobytahoe
We have evaluated (in-house) the following machines: Agilent SP50, CyberOptics SE300, Siemens OS. We have also evaluated the MVP machine and the Orbotech machine off-site. Best bang for your buck??? CyberOptics by far! Better Gage R&R, better standa
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Agilent Technologies Model: SP50 Series II Details: • Automated Paste Inspection • Version 3.1.6, Windows 2000 • Max PCB 20x20 • 2D and 3D Inspection • 240vac Condition: Complete and operational Location & Shipping: USA / FOB Ava
Used SMT Equipment | SPI / Solder Paste Inspection
Details: • 240V – 50/60 Hz – Single Phase Condition: “As is Where Is” Location & Shipping: USA / FOB Origin Availability: Immediate for purchase
Industry News | 2014-02-11 18:21:25.0
SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 8-10, 2014 at the Eastin Hotel in Penang, Malaysia.
Industry News | 2012-04-24 13:52:50.0
The SMTA South East Asia Technical Conference on Electronics Assembly Technologies that took place April 18-20, 2012, in Penang, Malaysia, was a resounding success. SMTA reported that attendance increased 45% from last year and was very well received by attendees.
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
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für bis zu 25 CAD Formate Footprints von Datenblättern 3D STEP (50+ Komponentenfamilien) PADS zu CAD Funktion v20200824 UMGEBUNGEN IPC, Manufacturer Recommended, User-Defined ROTATIONEN PAD SHAPES Rounded Rectangle Oblong Rectangle D-Shape JEDEC DIMENSIONEN FOOTPRINT ELEMENTE DER
