G 5003 - LR Ink Mixer and Defoamer (Air Bubble Remover) R&D for Best Mixing Solution: Ink for Printed Circuit Boards, AB paste and Ag (Silver) paste mixing and defoaming solution. Great use for: PCB Factory, Glass Panel Factory, Photoelectric Ind
In many cases the casting process is carried out under a vacuum to prevent air pockets. Trapped air bubbles reduce heat dissipation, since air is a good heat insulator, or they give rise to disruptive electrical charges in high-voltage applications,
Electronics Forum | Wed Jan 17 12:10:47 EST 2018 | guilherme_castro
I have the follwing problem in our proccess we have to many problem with via hole and trought plated holes like voids air bubbles . During the eletricial test process our machine is not detecting this problems , the voids and air bubbles How
Electronics Forum | Wed Apr 07 13:02:05 EDT 2004 | Marco Serrano
Had anyone experienced air bubbles inside of the Loctite glue syringes? If any of you do What have you done to rid off this problem? Thanks in advance!
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2024-10-06 08:00:38.0
In the world of electronics manufacturing, soldering plays a critical role. The PCB reflow oven process has revolutionized the industry by improving the quality of solder joints, especially for high-reliability applications like aerospace, automotive, and medical devices. But what exactly is this process, and why should manufacturers consider it?
Parts & Supplies | Air / Vaccuum
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Technical Library | 2021-12-31 06:55:24.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
Technical Library | 2021-12-31 06:56:02.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
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are accelerated by stronger buoyancy forces making them more likely to escape The pressure inside trap gas per the Young- Laplace Equation Pressure trapped inside a gas bubble changes according to Young-Laplace Equation Pbubble = Pambient + 2g / r (where “g
