New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
AB component adhesive potting and encapsulation machine for PCBa assembly Product Description CCD Vision Dispensing Systems: Revolutionizing accuracy and quality control, CCD vision dispensing systems integrate advanced imaging technology with pre
Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap
I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe
Electronics Forum | Tue Jun 17 11:02:47 EDT 2008 | dwelch123
You need to adjust the air kiss. The machine blows a slight amount of air after placement and it is probably adjusted too high.
Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Low Force Placement Solution For Delicate
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
an inappropriate paste, paste that has been on the stencil too long, inaccurate component placement or an improper reflow profile
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
an inappropriate paste, paste that has been on the stencil too long, inaccurate component placement or an improper reflow profile
