The Despatch RA Reach-In Oven is designed with the user in mind. Features include user-friendly controls; small footprint to conserve valuable floorspace; front access maintenance panel; and ergonomic design. The RA Reach-In Oven features high volume
Filter units with airflows up to 2000 cfm to filter and recirculate process exhaust from wave solder units, reflow ovens, etc. Provides excellent flexibility and eliminates venting to the outside.
Used SMT Equipment | General Purpose Equipment
Blue M Oven Model POM-206B 208VAC Single Phase, 60 cycle, 1/4 HP Motor, * Max Temp 343 C * Internal Oven Dimensions: 20-(wide) x 18-(deep) x 20-(high) * External Oven Dimensions: 42-(wide) x 32-(deep) x 50-(high) * Temperature Maximum: 650F (for
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2025-09-24 21:10:43.0
Simplify sustainability by reducing energy, eliminating curing ovens, and enhancing throughput with environmentally-conscious conformal coating solutions
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
Baja Bid | https://bajabid.com/wp-content/uploads/2021/09/Despatch-LAC-Spec-Sheet.pdf
LAC Spec sheet 03-20.indd The LAC high-performance bench-top oven uses horizontal recirculating airflow to ensure uniform temperatures throughout the oven
Lewis & Clark | https://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
.gif)
