New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Rework & Repair Equipment
The EXPERT 10.6 systems are rework stations that handle the complete rework process for SMDs. All versions utilize Auto Vision Placement Technology and are expandable with residual solder removal and dispensing functions. EXPERT 10.6 HXV - Syste
Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
Electronics Forum | Wed Jan 13 20:44:42 EST 1999 | Steve Gregory
Hello Sanjay! The cheap deal I use that Earl spoke of is called a SMarT Measure. It's a depth measuring microscope that uses the same principle of measuring optical focus that the units from Vision Engineering do ( if you've ever looked at any
Used SMT Equipment | Screen Printers
Ekra Model Number: X5 Serial Number: 801168 Year 2005 Fully Automatic In Line PCB Hold down Clamping System Auto Vision system with patented look up/down stencil to board alignment 2.5 D post print inspection Pressure Controlled Print Head U
Used SMT Equipment | Screen Printers
HORIZON 02i Approx. Weight 820kg boxed 677kg unboxed Approx. Dimensions 2060mm x 1500mm x 1570mm (81.1” x 59” x 61.8”) Accuracy and Repeatability 1.6 Cpk @ +/- 25 m Cycle Core Time 12 seconds Max. Board Size (Print Area) 508mm (X) x 508mm (Y)
Industry News | 2023-10-02 10:05:09.0
IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs. This collaboration includes expanding its course offerings to include self-paced courses on soldering, inspection, and manufacturing engineering. With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.
Industry News | 2020-04-14 22:07:07.0
ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.
Technical Library | 2023-07-25 16:25:56.0
This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package.
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
SMT Stencil Printers for PCB Assembly ETA high accuracy PCB printing machine, solder paste printer, automatic stencil printer with best quality and service. ❙ Introduce of PCB Printing Machine 1.Using linear guide-ways, matching
ETA P12 Automatic Stencil Printer for LED Line ETA high accuracy PCB printing machine, solder paste printer, automatic stencil printer with best quality and service. ❙ Introduce of PCB Printing Machine 1.Using linear guide-ways,
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
specified board, micro-stencil, part, and solder paste to
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