New Equipment | Test Equipment
Description The Agilent 8561E portable RF spectrum analyzer offers the measurement capability and performance previously found in larger, more expensive benchtop analyzers. This analyzer combines outstanding phase noise, sensitivity, 1 Hz resolution
F130AI: Featuring the "Planet Head" - the world's most compact and unique rotary head, the F-series mounter offers great precision by controlling the planet gears with a fully closed rotary servo. Bi-directional head rotation supports the optimal h
Electronics Forum | Thu Mar 13 09:23:26 EST 2003 | jrloudenjr
What types of systems/procedures are normally used or followed to allow for scrap percentages typically from a 43,000cph placement machine.
Electronics Forum | Fri Jun 26 19:02:09 EDT 1998 | Rin Or
I am very interesting of getting information about the criteria inspection of BGA. Example, what are percentage allowance for void, solder joint volume etc.. Any information feed back will be greatly appreciated.My factory just install the Nicolet NX
Used SMT Equipment | General Purpose Test & Measurement
Description Migrate from 856xE/EC to X-Series signal analyzers The Agilent 8561E portable RF spectrum analyzer offers the measurement capability and performance previously found in larger, more expensive benchtop analyzers. This analyzer combines
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(in same plane as the TIM) area as a percent of the overall TIM coverage area. There is an increasing trend amongst solder TIM users towards both defining both a lower overall voiding (%max void total), and a maximum allowable void size or areal
