Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
A Practical Guide to Achieving Lead-Free Electronics Assembly A Practical Guide to Achieving Lead-Free Electronics Assembly AIM Credit/Source: Karl Seelig, David Suraski To successfully achieve lead-free electronics assembly, each participant
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
“Shandong Zhaojin Gold & Silver Refinery Co., Ltd” 5. Added “Shandong Zhaoyuan Gold Argentine refining company limited” as an alias of “Zhongyuan Gold Smelter of Zhongjin Gold Corporation
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
& Measurement Equipment Keysight, Agilent, HP, JDSU & TDK Gear! Fujikura Fusion Splicer & Miyachi Solder/Weld System Milford, CT DZS (Day 2) [Online] SOLD - Auction Closed on 3/15/2023 Closure of Global Telecom Provider
