Industry Directory | Manufacturer
Cookson Electronics is a leading materials science company that provides high performance materials, Soldering Pastes
Industry Directory | Manufacturer
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Hanwha Decan S2 SMT Assembly l
Lead-Free, no-clean, water soluble Universal no-clean solder pastes that conform to customer processes as well as environmental regulation. Cookson Electronics offers a full line of all-around ALPHA� solder pastes that covers the complete range o
Electronics Forum | Fri Aug 01 12:35:54 EDT 2003 | blnorman
Kester recommends that we store our 1400 gm tubes on the tip. Our documentation is based on their recommendation. The Alpha past we used was stored horizontally, but that was because the flux readily separated from the metal.
Electronics Forum | Mon Sep 25 18:40:24 EDT 2000 | Steve Thomas
I'd heard that Alpha did paste reclamation but just assumed they only offered the service for customers using their paste. Hmmmm, it's worth a call, anyway. Thanks for the contact.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
ALPHA® Preforms with solder paste adds solder volume.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
Events Calendar | Thu Mar 26 00:00:00 EDT 2020 - Thu Mar 26 00:00:00 EDT 2020 | ,
Automotive Electronics Webinar
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/how-can-i-toggle-pin-number-from-alpha-to-numeric_topic1583.html
How Can I Toggle Pin Number From Alpha To Numeric? - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login How Can I Toggle Pin Number From Alpha To Numeric
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/esman-electronics-seminar-2014
: How to Choose the Right Solder Paste? - Gilbert Renaud, Alpha Alent 14: 30 – 14:45: Market Trends and Latest Developments UV Curing Materials and Two Components Coating - Jacques Mycke, Nordson Asymtek 14:45 – 15:00: Çay - Kahve Molası 15: 00 – 15:45
