Industry Directory | Manufacturer / Manufacturer's Representative
Hiflo Solders Private Ltd (HSPL) , was established in the early nineties and has grown into a business enterprise in manufacturing and marketing of Solders, Fluxes, Cleaners, Anodes, Soldering Accessories for the domestic & inte
Industry Directory | Manufacturer
Almit is one of the leading providers of solder wires, solder pastes and of course lead-free solders, which are also successfully applied in the aerospace industry, in the automotive field but also in consumer electronics.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Electronics Forum | Wed Jan 17 22:35:21 EST 2007 | JNet
Is the oven air or nitrogen? If it is air I would suggest more exhuast to pull the flux vapors out if the oven before they can condense in the cooling. If it is a nitrogn machine that makes it a little more complicated. If the filter system is clogge
Electronics Forum | Wed Jan 17 21:40:49 EST 2007 | Sumbi
Oven keeps building up debri in cooling plates and flux system seems not very good. would preferr less maintance,no time. know of any work arounds.Oven is Paragon series.
Used SMT Equipment | Soldering - Reflow
BTU PYRAMAX98A Reflow Oven (Air) with Enhanced Cool 08/2005 Air Only Programmable Width Adjust Edge Rail Center Board Support with Hide Away Option SMEMA 3'' Tunnel Clearance Light Tower (ready/not ready) Closed Loop Convection Control Flux
Used SMT Equipment | Soldering - Reflow
BTU PYRAMAX98A Reflow Oven with Enhanced Cool 05/2007 Includes: Tek-Temp TKD Recirculating Water Chiller for Enhanced Cool Optionir Only 24'' Programmable Width Option Edge Rail Center Board Support with Hide Away Option SMEMA 3'' Tunnel Clea
Industry News | 2018-10-06 11:20:42.0
How to Maintain a Reflow Oven?Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality.
Industry News | 2014-04-02 17:56:58.0
BEST Inc , Rolling Meadows IL, announced the release of a new shopvac like product for the PCB rework and repair area. Connected to shop air this product is able to suck up liquids and solids,
Parts & Supplies | Component Packaging
Panasonic CM402/CM602 N210027498AB PLATE ALUMINIUM N990PANA-028 GREASE ,OIL N9973GB1 VACUUM TESTER N55597LC-019 PACKING N60022 RH6 MOTOR N0070031 MOTOR N0070032 MOTOR N94199YA LENS N98606.1-695 CABLE DUCT N0220044 BLADE N238109P-103 BM FEN
Parts & Supplies | SMT Equipment
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
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