Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Manufacturer
Specialized HDI PCB manufacturer in china,Low cost PCB prototype,The LED PCB Aluminium PCB Manufacturing specialists,low volume PCB supplier,Flexible Circuit Board Fabrication,Provided“PCB & PCBA One-stop shop”service.
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
Electronics Forum | Tue Feb 11 12:59:26 EST 2003 | matherat
The assembly process involves activity before you get to reflow. Reflowing is the easy part. Putting paste down and placing parts in wet paste is the terrifying part. Benchtop reflow ovens can be a real handy tool for small production but with the g
Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel
Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t
Used SMT Equipment | Soldering - Reflow
Largest Heater Load:13A Short circuit interrupting capacity:5000A Condition:Excellent
Used SMT Equipment | Soldering - Reflow
Largest Heater Load:13A Short circuit interrupting capacity:5000A Condition:Excellent
Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
Industry News | 2018-10-18 09:42:39.0
SMT reflow oven process principle and introduction
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Grand Rapids, Michigan USA | Engineering
MAIN DUTIES: Performs new process development, monitors and maintains the processes in all areas of manufacturing including, but not limited to assembly, soldering, conformal coating, prep and related equipment. Responsible for generating, i
Career Center | chennai, Tamil nadu India | Engineering,Production
KEY SKILLS; 1.PRINTING, PICK AND PLACE MACHINE OPERATION, 2.REFLOW OVEN CHARACTERISTICS, 3.IPC STANDARD,QUALITY POLICIES 4.AOI PROGRAMMING 5.c,c++LANGUAGES. 6.VerilogHDL. 7.ORCAD,PSPICE software known.
Career Center | Nashville, North Carolina USA | Engineering,Maintenance,Management,Sales/Marketing,Technical Support
Screen Printer programming, maintenance, calibration Placment machine programming, mainteanance, calibration SMT Process and Manufacturing engineering Project Management New model introduction Supervision skills Training skills Leadership knowledge S
Heller Industries Inc. | https://hellerindustries.com/videos/hco-n2-04-inert-atmosphere-curing-oven-with-4-magazine-capacity/
HCO N2-04 Inert Atmosphere Curing Oven with 4-Magazine Capacity - Heller Home » HCO N2-04 Inert Atmosphere Curing Oven with 4-Magazine Capacity HCO N2-04 Inert Atmosphere Curing Oven with 4-Magazine Capacity Your browser does not support the video tag
| https://www.smtfactory.com/Hot-Air-8-Trays-Electric-Reflow-Convection-Oven-with-High-Quality-pd48530624.html
: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to
