Electronics Forum | Wed Apr 14 19:47:13 EDT 2021 | solderingpro
Sounds like you may have already found the issue: inconsistency from your supplier. Seeing as Gold really doesnt oxidize and you're using an inert environment (N2 I suspect), I would turn my attention to the supplier. You said yourself, the "Shine
Electronics Forum | Wed Jun 25 08:50:54 EDT 2003 | russ
I believe that Fancort makes some finger protectors that are made of Metal (Aluminum, titanium, etc...) I don't know how well these would process through placement equipment however due to their thickness. Could you clean the Kapton residue off just
Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Materials 1200 Titanium Bar Material Voids 1202 Molybdenum Plate Material Voiding 1203 Ceramic Material Voids and Virtual Cross-Section 1204 Polymer Coating to Aluminum Plate Delamination Other
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incorporated into the designated interlayer, and then heated, pressurized and bonded. As for the subsequent Drilling is the same as the plated through-hole method of the double-sided board. [Comments:0/ Comment ] [ Bookmark ] [ Big Medium Small ] [ Print ] [ Close
