Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a highquality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board a
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Used SMT Equipment | Semiconductor & Solar
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
Used SMT Equipment | Circuit Board Assembly Products
running condition for aluminum wire bond
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Separate precise SMD thin board, aluminum PCB, for special board , needs customization. If any question, just feel free to contact bella@qy-smt.com and browse Website?https://morel-equipment.com/
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. In addition, it performs well after exposure to humidity and hot/cold cycles. Provides some initial repositionability when bonding to plastic parts (not metal
