4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Electronics Forum | Wed Sep 01 05:44:18 EDT 1999 | Wolfgang Busko
| | I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under di
Electronics Forum | Tue Aug 31 14:36:41 EDT 1999 | JohnW
| I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under diff
Industry News | 2010-08-17 13:40:20.0
The SIPLACE Team has unveiled its latest placement machine, the SIPLACE SX4. As a high-speed addition to the SIPLACE SX platform, the four-gantry machine sets new standards in terms of placement performance per square meter of floor space – an important metric in the investment decision-making process. With its placement speed of up to 120,000 cph on a footprint of only 1.90 x 2.65 meters, the new machine even surpasses the previous record-holder SIPLACE X4i in terms of performance per square meter.
Industry News | 2021-12-19 20:18:34.0
Encoder is a kind of electromechanical equipment, which can be used to measure the movement of machinery or the target position of machinery. Most encoders use optical sensors to provide electrical signals in the form of pulse sequences, which can be converted into motion, direction or position information in turn.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
& scratch file allowed. Terms: Credit Card Only.( For All Customers). We accept American Express, Visa and Master card. Credit card will be charged at the time of the order
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Pressure-Reservoir-User-Guide-22200605.pdf
. Part Identification Figure 1: Reservoir parts identified 1 air pressure regulator Controls the amount of system air pressure allowed into the res- ervoir
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