Refurbished High Speed JUKI KE2060M Pick and Place Machine MC Model KE2060 Board size M size (330x250mm) L size (410x360mm) L-wide (510-360mm) E-size （510x460mm）
Yamaha YSM10 Pick and Place High-Speed Modular SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT Pick and Place Machine, Yamaha Chip mounter, for SMT assembly system. Applicable PCB L 510 x W 460mm - L 50 x W
Used SMT Equipment | Chipshooters / Chip Mounters
Model :KE-760 Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg jenny@ksunsmt.com
Used SMT Equipment | Pick and Place/Feeders
Model :KE-760 Pick and Place Machine Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the mac
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2008-05-03 17:15:32.0
PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a new level. Doubling the speed of the link to 5 GT/s, while maintaining backwards compatibility with PCI Express 1.0 potentially opens up interoperability issues. This presentation describes the methods and tools required to validate PCI Express 2.0 designs.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Yamaha YSM10 Pick and Place High-Speed Modular SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT Pick and Place Machine, Yamaha Chip mounter, for SMT assembly system. Applicable PCB L 510 x W 460mm - L 50 x W
Panasonic NPM-W2 SMT Pick and Place Machine ❙ Introduce of Panasonic SMT Pick and Place Machine Explore the Panasonic SMT Pick and Place Machine, known for its high-quality performance in component assembly. Improve production efficiency and accu
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Previous Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
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PANASONIC 2D2S D=0. 6mm P=0. 8mm 1048370240 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products SMT Nozzles 2hole/2 stopper, 2S D0. 6mm P0
