Datum Alloys is an international supplier of speciality metals and special purpose alloys,
Applied Ceramics is a fabricator of custom-made ceramics, quartz, silicon and sapphire spare parts designed for the semiconductor industry.
Tungsten and Molybdenum Boats Typical application Lighting Technology:lamp electrodes for creating the arc in discharge lamps, filament wire for halogen lamps, tubes for annealing filament wires, Evaporation boats for coating cold-light reflect
Supply seamless steel pipe 1. Outer Diameter: Hot finish: 400 – 1020mm, Cold drawn:3.72 – 457mm 2. Wall Thickness: Hot finish: 16 – 200mm, Cold drawn: 1.7 – 22.5mm 3. Standard: ASTM A106, ASTM A53, ASTM A179, API5L GR.B, X42, X46, X52, 4. Lengt
Electronics Forum | Wed Mar 28 20:00:03 EST 2001 | manish01
Hi. Does anyone out there know who the significant equipment manufacturers for annealing are !!!. I need this information desperately and your help will be greatly appreciated. Regards, Manish
Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
Industry News | 2012-02-28 19:55:52.0
Count On Tools has added a Laser Marking & Engraving capability to its manufacturing operations at its facility in Gainesville, GA. The recent expansion is in response to the growing market for SMT nozzles and consumables as well as the increased demand for its precision contract machining services.
Industry News | 2011-04-29 19:55:58.0
BTU International announced the receipt of an order for multiple hydrogen annealing furnaces from a major Asian solar cell manufacturer.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
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