Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 18 years, kinds of smt spare parts,like feeder ,nozzles,motors,fitlers and smt machine,juki ,panasonic ,yamaha,siemens,samsung(hanhua) ; peripheral equipment ,conveyor,AOI,spi,reflow oven
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Wed Aug 22 12:30:34 EDT 2001 | slthomas
Now that's an approach I've never thought of, inspecting a different portion of each board (I'm assuming that you program a few different patterns and run them sequencially, or something like that). I know our stencil printers don't provide that opti
Used SMT Equipment | SMT Equipment
Product name: KE - 3020 va/VRA general placement machine at a high speed Product number: KE - 3020 va/VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed high quality electric production
Used SMT Equipment | SMT Equipment
Product name: KE - 3020 va/VRA general placement machine at a high speed Product number: KE - 3020 va/VRA Detailed product introduction Constantly improve the KE series products. So as to realize the high speed high quality electric production
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2014-09-18 16:48:26.0
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless, the mechanical and thermal reliability of a Printed Circuit Board (PCB) has to remain at the same high level or even increase (e.g. multiple lead-free soldering). To achieve these reliability targets, extensive testing has to be done with bare PCB as well as assembled PCB. These tests are time consuming and cost intensive. The PCBs have to be produced, assembled, tested and finally a detailed failure analysis is required to be performed.This paper examines the development of our concept and has the potential to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Operator in our Lighting Manufacturing facility in Racine, Wisconsin. Location: Racine, WI Shift: 7AM - 3PM (Monday - Friday) Full-time w/benefits! Summary: This person will be a primary contribut
Career Center | Phoenix, Arizona USA | Production,Quality Control
Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri
Career Center | cabuyao, Philippines | Engineering
I had 9 years working as a technician starting in Smart electronic)as Mainline Technician. SGIC(Sanritsu Great International Corporation) as SMT mainline Techinician and IMI (Integrated Micro-Electronics INC,)as SMT Process Technician.
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
Imagineering, Inc. | https://www.pcbnet.com/blog/succeeding-at-on-time-delivery-with-just-in-time-production/
Succeeding at On-Time Delivery with Just-in-Time Production | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
Heller Industries Inc. | https://hellerindustries.com/parts/422010/
422010 - BUSHING ASSY, CLS, 24" MAX BOARD- Same as PN587137 Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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