Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Manufacturer
Manufacturer of Laser Cut & Chemical Etched Stencils.
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Industry News | 2016-02-27 20:41:52.0
BEST Inc. instructors will be conducting 2 training sessions this year at the APEX Expo 2016 - Advanced Rework: Hands-on BGA Reballing, Lead-Free Devices, and Fine-Pitch Parts, and the 2nd session - Stencil Printing: Consistent Print Volumes for SMT Rework.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Technical Library | 2017-03-30 18:34:52.0
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | Irvine, California USA | Sales/Marketing
We are a contract manufacturing company specializing in SMT, Thru-Hole and BGA assembly. Our niche is prototypes and medium volume. Visit our website at www.gmtechnical.com for our capital equipment listing and our capabilities. We are looking fo
Career Center | San Jose, California USA | Engineering,Research and Development
www.srqconsultants.com : for job reqs Type of job background: Design for Test (DFT), with ATE Test development experience, and an IC design generalist. Job Summary Must have +5 years industry experience combination in IC Design and ATE test. Som
Career Center | Sparks, Nevada USA | Engineering,Management,Production
Felix Gutierrez Bueno 3906 Dominus Drive, Sparks. NV. 89436 Cel: 775-313-2975 felix.gutierrez23@yahoo.com *SMT Manager * Sr. SMT Process Engineer * Manufacturing Engineer * Maintenance and repair Supervisor * Background Broad Experience serving as:
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-nozzles-for-shuttle-star-bga-rework-stations
BGA Rework Nozzles for Shuttle Star BGA Rework Stations – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
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IPC-7095C – The Definitive Source for Everything BGA | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
