938 apm 2200 die bonder training results

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Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process


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2024 Eptac IPC Certification Training Schedule

High Precision Fluid Dispensers
Conductive Adhesive & Non-Conductive Adhesive Dispensing

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

Reflow Soldering 101 Training Course
PCB Handling with CE

Software for SMT placement & AOI - Free Download.