3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Electronics Forum | Wed Jan 26 12:25:49 EST 2000 | Franck Bourrieres
No reduction are required, the screen should have appertures of the same size than the pad.
Electronics Forum | Wed Feb 04 11:52:27 EST 2009 | steverog
I am trying to find out the year of introduction for each of the standard SMD passive parts. I require this information for a piece of research I am conducting In particular I would like to know in which year the following part sizes were first intr
Industry News | 2010-06-11 14:35:28.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released a full line of standard 300-series nozzles for the Assembléon MC-24 and MC-24X as well as the Yamaha YG300. The new line is capable of handling components sizes from 01005 to larger BGAs and QFPs for large mix and minimum changeover to optimize production lines.
Industry News | 2020-09-06 04:48:32.0
Count On Tools, Inc. (COT) is offering 10 percent off of custom orders for new customers effective immediately through the end of the year.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Parts & Supplies | Chipshooters / Chip Mounters
Yamaha nozzle for for all model machine Yamaha nozzle for for all model machine Yamaha 0201 01005 03015 nozzle for Yamaha Chip mounter KHY-M7710-A0 311A - 0.35 x 0.75mm - (0201/01005) Yamaha YS12 / YG300 Nozzle 301 / 302 / 309 Diamond steel Y
Technical Library | 2018-03-05 11:22:48.0
Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
ii-Feed is based on the strengths of Europlacer's proven concept of a cart plus elements but incorporates key aspects of our individual feeder technology, merging the best of both technologies. http://www.europlacer.com/en/ii-feed.html
01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components miniature size made them difficult
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Call for Papers | SMTA International 🏠 2020 Conference 2019 Conference Technical Program Technical Committee Best Papers Exhibition Attend the Expo Sign Up to Exhibit 2020 Exhibitor List Sponsors Sponsor List Become a Sponsor Call for
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1384&OB=DESC.html
0.20 mm Toe was too robust for the 0402 and the 0201 is 50% smaller and the 01005 is 50% smaller again. So we first had to develop an acceptable Toe goal for the 0402 and the
