Systronix, Inc. is an industry leader in the supply of electronic manufacturing services. We provide a broad range of services to leading companies in industries that require high tech, high quality and highly reliable electronics.
Industry Directory | Manufacturer
Radiotronix set as its goal to create a new generation of highly-integrated IC-style RF module that combined ease of use, enhanced performance and lowered customer cost.
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
Electronics Forum | Thu May 26 15:28:41 EDT 2005 | jh0n!
It looks like there's another one or two threads somewhat similar, but allow me to pose another. We've only about two years experience in SMD production, and we're just starting to really ramp-up. As we stand right now, I'm not recieving informatio
Electronics Forum | Thu May 26 19:29:35 EDT 2005 | jh0n!
Yeah - I can handle most scripting/programming - but I'm completely unfamiliar with this side of these machines. For example, when looking at the Aegis software, they're tracking real-time defects, etc....That's what I'm curious about there - how to
Used SMT Equipment | In-Circuit Testers
Key Features & Specifications Superior Oscilloscope Signal Integrity - 12 GHz bandwidth. - 40 GSa/s on each of 4 analog channels - Standard 50 Mpts memory per channel - Includes Serial Data Analysis and EZJIT+ software Engineered for
Used SMT Equipment | In-Circuit Testers
Description Keysight's DSA90000A series oscilloscopes add Serial Data Analysis, EZJIT+, 50 M memory standard to the equivalent DSO90000A products. The Infiniium DSO90000 series boasts industry-leading technology that allows for superior oscillosc
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Parts & Supplies | SMT Equipment
SMT PART E9629729000 4633N2020600 Z axis motor for JUKI E9627727000 CCD CAMERA CS4200J E9627729000 Z / THETA DRIVER (4 SHAFT FMLA) E9628727000 ROBOT CAMERA CABLE (5M) E9628729000 DRIVER (FOR 2 SHAFT FMLA) E96287800A0 M HEAD SENSOR ASM E9629729
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Parts & Supplies | Assembly Accessories
00306736-01 PROXIMITY SWITCH 3RG4/8x8mm/sn=3,0mm/1S 00306741-02 MOTOR INCREMENTAL SHAFT ENCODER Z-AXIS 00306743S02 SIPLACE GLUE APPLICATION HEAD HEAT EXCHANGER 00306745-02 EVACUATION OF AIR VALVE 00306752S01 AMP QUICK CONTACT BU 0,
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Fremont, California USA | Production
SMT Operator Duties include machine set up and load, parts value verification, screen printing, hand loading, reflowing. Operator is responsible for aligning and hand placing parts on boards and working the reflow oven. Performs basic machine set up
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
| https://productronica.com/en/exhibitors/stand-marketing/lead-tracking/
Scan2Lead customer data management for exhibitors Deutsch Contact Contact for visitors Contact for exhibitors World’s Leading Trade Fair for Electronics Development and Production November 14–17, 2023
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1795&OB=DESC.html
. So, I wrote a little VB.NET application to read information from www.pcblibraries.com/pod/ . Every single day at the same time I was acquiring data from that page
