Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86140B Optical Spectrum Analyzer. Passes self test - no option. Built-in test applications, 10 pm wavelength accuracy, Fast dual-sweep method, Covers S, C, and L wavelength bands. SN# US40461075 Room 4C. SN# US40461
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86142B Optical Spectrum Analyzer. Passes self test - no option. Best suited for WDM component and system test applications where power and wavelength accuracy, dynamic range and low polarization dependency are criti
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT) Recert.
The Certified IPC/WHMA-A-620 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Specialist (CIS) training.
Events Calendar | Mon Oct 14 18:30:00 UTC 2024 - Wed Oct 16 18:30:00 UTC 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Events Calendar | Mon Aug 10 18:30:00 UTC 2020 - Mon Aug 10 18:30:00 UTC 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | All over the world, Alabama USA | Engineering
2023 is the year for I.C.T's global localization strategy, and we are seeking talented individuals worldwide for the following positions. I.C.T adheres to the principles of "Simple, Open, Undertake, Coordination and Share" to build a pl
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
Career Center | Maricopa, Arizona USA | Engineering,Maintenance,Production,Quality Control,Technical Support
• Diagnose, troubleshoot and repair state of the art 3D automated optical inspection equipment. • Provide training to customers and junior engineers on applications, program and algorithm / program development. • Provide advanced application consul
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2990.html
: MICROTIPS MEDIUM PRECISION APPLICATOR MICROTIPS MEDIUM PRECISION APPLICATOR PREVIOUS： 03020841-02 NEXT： 03020930-01 RELATED PRODUCTS CATEGORIES ABOUT US
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/13?order=list_price+asc
0.0 CNY ANTI STATIC GLOVE - SIZE -M (副本) ¥ 0.00 0.0 CNY APPLICATOR K1000 110/220V HOT MELT 11MM ¥ 0.00 0.0 CNY SOLDERING IRON TIP SLOT TYPE 1.6MM L17MM ¥ 0.00
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