Electronics Forum | Mon Jan 03 11:33:15 EST 2000 | Zaklas, Yosef
Dear Sirs: We use BGA ceramic components in our assemblies. We would like to know if there is a technical problem of SMT assembly and reflow of these components on aramid surfaces. Yours immediate reply would be appreciated.
Electronics Forum | Tue Jan 04 19:55:46 EST 2000 | Rob Thomas
Hello Yosef, non woven aramid reinforced pcb's are used where is a need for low CFT (coefficient of thermal expansion). Traditionally aramid pcb's were used in military applications in order to reduce the stress/failure rate of solder joints during
Industry News | 2001-12-17 07:49:03.0
The following IPC products have now been released.
Industry News | 2010-04-23 22:01:16.0
BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
ORION Industries | http://orionindustries.com/steel-rule-die.php
: Many materials require cutting tolerances much greater than the tolerance of the tool. For example, Nomex aramid paper is hygroscopic and can expand up to 2
