Electronics Forum | Mon Jan 03 11:33:15 EST 2000 | Zaklas, Yosef
Dear Sirs: We use BGA ceramic components in our assemblies. We would like to know if there is a technical problem of SMT assembly and reflow of these components on aramid surfaces. Yours immediate reply would be appreciated.
Electronics Forum | Fri Jun 25 14:22:40 EDT 2004 | jjh
Will there be any problems with reflow when using CCGAs on nonwoven aramid reinforced pcbs? thanks!
Industry News | 2001-12-17 07:49:03.0
The following IPC products have now been released.
Industry News | 2010-04-23 22:01:16.0
BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
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