Lutron Electronics is the world leader in the design and manufacture of architectural lighting controls and systems.
Industry Directory | Recruiter / Employment Company
Recruiers specializing in Engineering, Technicians, Scientist, Architectures, Designer professionals.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Assembly Services
Digicom Electronics' ROACH (Reconfigurable Open Architecture Computing Hardware) system was developed with major universities and research labs throughout the world. The ROACH system takes the baseband data from the most powerful radio telescopes, c
Electronics Forum | Thu Mar 25 02:03:49 EST 1999 | Stoney Tsai
| | We have been evaluating a trial copy of FujiCAM for several months. Are there any other users of FujiCAM out there that would be willing to share experiences. | | | I have had it installed for about a month. Aside from a few bugs | (new rev
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
Used SMT Equipment | Pick and Place/Feeders
The NPM-WX & NPM-WXS single-beam variant is designed around a stiff frame, constructed of durable materials and built to last. With onboard dual-drive linear motors complimented by light and rigid beam architecture, the NPM-WX & NPM-WXS introduces ne
Used SMT Equipment | Adhesive Dispensers
The Camalot® Prodigy™ dispensing system employs breakthrough technology innovations to enable higher process speeds, more precise accuracies, tighter tolerances, and higher yields. A state-of-the-art X Y gantry system is the heart of this next genera
Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Parts & Supplies | Pick and Place/Feeders
SM FEEDER smt feeder cart for samsung Product Name:SAMSUNG SM smt feeder storage cart Dimensions(mm):930*600*1170 Product Description:40 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder Turnover store,Increase p
Parts & Supplies | Pick and Place/Feeders
I-pulse smt feeder storage cart Product Name: I-pulse smt feeder storage cart Dimensions(mm):800*600*1000 Product Description:40 / Layer, 2 Layers Uses: For placing feeder,feeder preparation in advance,Feeder Turnover store,Increase productivity.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | Sunnyvale, California USA | Engineering,Research and Development
- We are seeking candidates at (BS, MS or PhD) levels in Electrical Engineering. - Strong familiarity with Processor / ASIC Architecture - 2-5 years of experience in ASIC Design, Synthesis & Simulation - Solid understanding of ASIC Design Flow - Kno
Career Center | Addison,Texas, Texas USA | Engineering
Design Verification Requirements: BSEE required (MSEE preferred).Minimum of 5+ years of functional design verification methodology experience for x86 processors at module, chip, and system level. Core compentencies must include solid microprocessor
Career Center | RANCHI, JHARKHAND India | Engineering
(1)-TECHNICAL SKILLS • SURFACE MOUNT TECHNOLOGY for PCB assembly • Cellular Mobile Communication • Mobile switching • Electronics device and circuits. • PCB card testing (2)-TRAINING SKILLS- (A) Six months industrial training at Indian Telephon
Career Center | Tirunelveli, Tamil nadu India | Engineering,Maintenance,Quality Control,Research and Development,Technical Support
I have no experience but i will do my best in this department.i am very interest to work in manufacturing department.my interesting subjects are VLSI,CAD for VLSI circuits and its related subjects. VLSI languages,Ns2,c,c++,Ms office
A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration
SMTnet Express, June 14, 2018, Subscribers: 31,125, Companies: 10,958, Users: 24,820 Unlocking The Mystery of Aperture Architecture for Fine Line Printing Clive Ashmore; ASM Assembly Systems The art of screen printing solder paste for the surface
| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print
. High Accuracy placement machines cannot go faster and a High Speed machine cannot simply be more accurate by going slower as it is not the intent of the design architecture
Heller Industries Inc. | https://hellerindustries.com/electronics-assembly/
. Heller offers both horizontal reflow ovens and vertical curing ovens . All of which provide true in-line architecture for higher throughputs and more stable processing compared with batch-type alternatives
