Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Thu Apr 09 22:32:58 EDT 1998 | Lou Silverstine
We are tring to locate a 9 segment LED & dectector array. It is used in a coin reader to measure the diameter of a coin. Any help in locating such an array will be highly appreciated.
Electronics Forum | Fri Mar 21 20:24:13 EST 2003 | msimkin
Has anyone had success in soldering these devices, in particular devices from a company callede Pycomp. They are 8 way 0402 sized terminations. I have experemented with the printing process, placement verification & reflow profile. Unfortuanlty, I am
Used SMT Equipment | SMD Placement Machines
* Windows NT * Super fine head * Line Array camera * Pneumatic Tape Feeder * Locate pin * Edge Clamp System * Z servo push up plate * Entrance sub stopper * Exit sub stopper * Auto width adjust * Hi
Used SMT Equipment | SMD Placement Machines
* Windows NT * Flying Nozzle change head * Line array camera * Pneumatic Tape feeder * Main Stopper * Locate Pin * Edge Clamp system * Z servo push up plate * Entrance sub stopper * Exit sub stopper *
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-02-05 09:14:02.0
The Event will be Held in the Wyndham San Jose Hotel on February 20, 2003
Parts & Supplies | Pick and Place/Feeders
basic assembly PPW 2 array/W5 magazine
Parts & Supplies | Pick and Place/Feeders
Option support ASP speed flex 2. array
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework
ML-2500S PCB Separator uses high speed rotation milling cutter to separate PCB array. Widely applied in digital, communication, lighting, etc. Which improved the defect on PCB separating caused by manual, V-cut, stamping, etc If you have any questi
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Career Center | Rochester, New York USA | Engineering
The position is for a Design Engineer specializing in CMOS image array design, designing state of the art image signal processing circuits including low noise amplifiers, switch capacitors, gain amplifiers, and A/D converters.Specializing in CMOS ima
Career Center | Beaumont, Michigan, Minnesota, Canada USA | Engineering
Infrared camera electronics design and camera design engineer. Manage electronic design, research and development, optimize current design, manage prototype design, fabrication and testing. Some optical design experience is preferred, but not not nec
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/zone-shear?con=t&page=2
für neue Anwendungen für großflächige Arrays geeignet. Nordson DAGE ist in der Lage, eine maximale Kraft von 80 kg bei 600 mm/Sekunde zu erzeugen
ASCEN Technology | https://www.ascen.ltd/Blog/machine/PCB_conveyor/
... Read more Printed circuit board PCB conveyor 1000mm for SMT assembly Printed circut board pcb conveyor belt Edge Conveyors are specifically designed for transporting PCBs, BGA flex arrays, MCMs, and
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