Industry Directory | Equipment Dealer / Broker / Auctions
Trading of Used Electronics and Semiconductor Machines and Equipment
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Used SMT Equipment | SMT Equipment
ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
