Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Industry Directory | Manufacturer
Full turnkey Contract Electronic Manufacturing service provider and part of TT electronics plc. ISO 9001 supplier with services including DFM, SMT, Hand, Test and Final Assembly plus much more.
New Equipment | Selective Soldering
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
ProDEK is an innovative and high performance closed loop system tool designed to ensure optimisation of the printing performance. Communicating between the DEK screen printer and solder paste inspection machine to identify any potential problems, Pro
Electronics Forum | Mon Mar 16 08:34:46 EDT 2009 | sachu_70
Hey Loco, how about saving the bottom side? It actually only depends on your oven setting specific to Top heaters and Bottom heaters. Unless you set the parameters rightly, you would face such issues. It only indicates that you need to seriously re-l
Electronics Forum | Tue Aug 31 10:52:19 EDT 1999 | Andreas Foehrenbach
I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under differ
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-04-02 08:27:45.0
eM-Assembly Expert 2.0 is a major upgrade to the proven electronics assembly and test solution from Tecnomatix Unicam.
Technical Library | 2008-02-20 21:42:52.0
Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
Technically speaking, iineo+ is a multi function SMT Pick and Place platform , with the highest level of flexibility and feeder count in the industry. It is widely configurable without the need to compromise on feeder count, placement speed or compon
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Career Center | County Durham, United Kingdom | Engineering
I am currently working on behalf of a Global Leader in Automotive Safety Systems based in the County Durham area of the UK. They are currently seeking to recruit an SMT Engineer whose main duties and responsibilities will compromise of the following
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
Placement Optimisation in a Lean Manufacturing Environment Placement Optimisation in a Lean Manufacturing Environment Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce
SMTnet Express, May 2, 2019, Subscribers: 31,890, Companies: 10,752, Users: 26,060 A New Line Balancing Method Considering Robot Count and Operational Costs in Electronics Assembly Credits: Fujitsu Laboratories Ltd. Automating electronics assembly
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
4.5 tc spacing Soldering lead reflow Heller 788 Heller 1913 788 K1800 1micron 1809 exl 4.x.x.x Industrial curing oven 1707mk5 Semiconductor equipment manufacturers Fluxless reflow soldering Qmi519 die attach Die attach conductive epoxy Semiconductor assembly Heller 1707 mkiii operation manual
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
