New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
New Equipment | Rework & Repair Equipment
The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-F
Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
| http://etasmt.com/te_product_g/2023-04-22/20631.chtml
. Control System Computer or Instrument control, make sure machine working steadily. 2. Hot Air Heating System Both top and bottom zones hot air heating,good heater compensatory,High thermal efficiency,energy saving,speedy heating,suitable for soldering components like BGA,CSP
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
solder voiding phenomena. REFERENCES [1] Ning-Cheng Lee, Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies, “SMT problems During Reflow, Section 6.1, Voiding,” Butterworth-Heinemann, Reed Elsevier Group, 2002. [2] R. J
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